Apple's 20th Anniversary iPhone Could Be an AI Monster, According to a New Report
The 20th Anniversary iPhone Will Bring a Big Step Forward in Processing; Memory Changes Could Speed Up AI Responses by a Huge Margin.
Apple is struggling to keep its iPhone lineup relevant in an AI-obsessed market. Despite having a significant lead in AI research for years, including using its own AI-focused chips, Apple could soon make other major changes to improve performance.
According to ETNews, Apple is seriously considering adding mobile high-bandwidth memory (HBM) to its 2027 iPhone lineup. It would be applied to the 20th Anniversary iPhone, along with other changes to the display and battery.
Using HBM would be a big change for Apple, as it is a technique that requires stacking layers of DRAM. Stacking increases the speed of signals and bandwidth, making it much faster and easier for the processor to access and secure data from storage.
HBM is typically connected to the application processor, but it can be connected to the GPU, which helps with AI processing. This is actually what Unified Memory does in Apple Silicon Mac models.
A source claims that Apple will use HBM for the 2027 iPhone, and is “considering design changes” to the application processor to make it more useful for AI processing. The source added that connecting the memory to the GPU is also “a possibility.”
The report believes that Apple has discussed this plan with memory suppliers, such as Samsung and SK Hynix. Both are making their own mobile HBM modules using their own packaging technology, with mass production expected after 2026. SK Hynix is doing so under the name Vertical Wire Fan Out (VFO) while Samsung Electronics is doing so under the name Vertical Cu-post Stack (VCS).
Reports emerged in December last year that Apple was working with Samsung to create faster memory for the iPhone. The goal was to create a larger DRAM package to increase the number of connectors, increasing memory bandwidth. Samsung and SK Hynix are fiercely competing in the mobile HBM module space. Each company could expand its existing HBM work in the server market to smartphones.
In addition, the 20th anniversary iPhone will feature changes to the display, such as switching to a 16-nanometer FinFET process for the OLED display driver chip (DDI) to save power. Additionally, they will eliminate bezels by curving all four sides of the display. Implementing an under-display camera will also be difficult because the display needs to transmit light without reducing the camera's image quality.
Samsung is also expected to use a new M16 material set for the iPhone 18 display and may create a custom material for this 20th-anniversary iPhone.
Other rumors say that Apple will use 100% graphite-free silicon material for the battery's negative electrode, which could increase battery performance and life. With AI having high processing requirements and high power, saving or improving battery life will certainly make AI more impressive.