The design of the Apple M5 chip will improve the performance of servers as well as future AI tools.
According to MacRumors, Apple will use more advanced SoIC packaging technology for its M5 chip, as part of a strategy to meet the growing demand for processing power for both Mac and advanced personal computers. performance of data centers as well as future AI tools in the cloud.
SoIC technology was developed and launched by TSMC in 2018, allowing the stacking of chips in a three-dimensional structure, providing better performance in power consumption and heat management than two-way chip design. system.
According to Economic Daily, Apple has expanded its cooperation with TSMC on a next-generation hybrid SoIC package that further incorporates thermoplastic carbon fiber composite molding technology. This package is said to be in pilot production, with the aim of mass production in 2025 and 2026, powering new Mac lines and Apple's cloud AI servers.
It is expected that this new technology will be integrated into the Apple M5 chip line. Additionally, Apple has been working on its own AI server processor manufactured using TSMC's 3nm process, targeting mass production in the second half of 2025.
However, according to Haitong analyst Jeff Pu, Apple's plan by the end of 2025 is to assemble an AI server powered by its M4 chip.
Currently, Apple's AI cloud servers are said to be running on multiple connected M2 Ultra chips, which were originally designed specifically for desktop Macs.
However, with the appearance of the M5, Apple may turn to this chip to enhance performance and optimize AI processing capabilities on its servers.
The advanced dual-use design of the M5 chip generation is said to be a sign that Apple is preparing plans to integrate its AI supply chains, from personal computers to cloud servers and software. This promises to bring better AI experiences to users on Apple products in the future.